Join Us at IMS2024: Booth # 2208
Join Us at IMS2024: Booth # 2208
MINNEAPOLIS, MN
10/16 -10/17
UPCOMING EVENTS…
WASHINGTON, D.C.
6/16 - 6/21
BOSTON, MA
10/01 -10/03
Live Demonstration in Booth with our Inkjet partner ChemCubed
Particle-Free Conductive Inks
PRESS RELEASE:
I-Connect007 (iconnect007.com)
American Standard Circuits Signs Licensing Agreement with Precision Circuit Technologies
January 29, 2024 | American Standard Circuits
Anaya Vardya, president of American Standard Circuits Sunstone, announces that his company has signed a licensing agreement with Precision Circuit Technologies (PCT), an operating unit of LCP Medical Technologies LLC. ASC Sunstone is now a licensed manufacturing partner for PCT’s high performance, high density, multi-layer Laminated Liquid Crystal Polymer (LCP) technology.
This technology will give ASC Sunstone the ability to provide customers PCBs with:
Up to 30 layers of LCP with sequential laminations
Sub 25-micron lines and spaces
Additive processing with 1 micron control of circuit geometries for 1-2% impedance control
Low loss performance beyond 120 GHz wireless and 112 gbps-224 gbps-448 gbps high speed digital
Solid copper full metal stacked vias through all layers
High speed flex, rigid-flex, rigid boards, RF MW modules and advanced semiconductor package substrates
This relationship establishes ASC Sunstone as a LCP production technology leader with a reliable manufacturing process that has been lacking in the industry. ASC and PCT will support customers jointly with dedicated applications and engineering support to provide sophisticated and complex high-performance circuits designed to meet next generation system speeds and circuit density requirements. The material set performance, design-rule based engineering and precision control of the circuit geometries provide unmatched capabilities compared to ABF, Polyimide, and other laminate construction. No other technology and material set can provide this level of density and performance across Flex, Rigid-Flex, Rigid Boards and Package Substrates and ASC will be the US standard.