Technology Overview

High frequency integration and Packaging requirements: High Performance, Low Cost, Multifunctional, Compact, Application Driven

As 5G (mmWave) applications emerge to accommodate ever-increasing demands for data, and at exponentiating speeds and densities, a number of high frequency challenges emerge:

  • Tight integration of mmWave active electronics, filters, and antennas

  • Multilayer PCB fabrication with line and space geometries below 25 microns

  • Metallization and smooth, well-defined surface and near-vertical edge topologies

  • Coefficient of Thermal Expansion (CTE)

  • Novel materials - paricularly LCP - with better electrical. microwave and thermal properties at low cost

  • Novel circuit design and thermal management techniques

Precision Circuit Technologies is your technology and manufacturing partner for developing solutions in next generation circuit design, using its patented Liquid Crystal Polymer (LCP) materials and processing.