LCP Properties

Liquid Crystal Polymer

Providing a high-speed, high-density alternative to conventional printed circuit fabrication techniques

As semiconductor and electronics markets have progressed, several technical factors have emerged that have significant impact to the electrical interconnects for “systems,” whether they be computer, handset, tablet, automotive, medical, telecom, data center, or military and aerospace:

  • Extreme increases in data traffic driven by internet, streaming video, smart phone, tablet and cloud computing are driving need for significant increases in bandwidth.

  • Increases in data rate and functionality are driving significant wide scale architecture evolution.

  • Advances in semiconductor packaging are driving significant density and routing challenges.

  • Power and thermal management pose challenges in low-voltage systems to preserve battery life.

  • Advances in semiconductor geometries have outpaced printed circuit geometries.

Risk Mitigation

The Company’s technology has resolved the historical risk of LCP delamination, with the ability to leverage the electrical and mechanical properties of the material with multi-layer circuit stacks and very fine circuit geometries with launch capability in the 20 to 6-micron lines and spaces range with extreme impedance control and low signal loss at high frequencies over 100 GHz.

Managing Complexity

The ability to create sub-25-micron lines and spaces is a critical aspect of substrate and ultra-high density printed circuits on a given layer. The Company’s technology focuses on the methods, techniques processes, and material sets needed to create complex multi-layer circuits and substrates.

Precision Control

A core principle of the Company’s fabrication process is precision control of the circuit geometries, dielectric separation, impedance control, layer-to-layer interconnects or via constructions, and die mounting terminations. The Company’s technology extends well beyond the LCP material itself, with the capability to adjust impedance values within <1 ohm by micron level adjustments to trace geometries and dielectric spacing.

12-layer rigid-flex LCP foldable motherboard that has the power of a commercial laptop computer and is the size of a credit card when flat.